Our highly competitive dicing service provides you with a rapid turnaround service on dicing production.
Work pieces handled include wafers, substrates, mask plates and laminates.
A wide range of different materials can be processed including: Silicon, Silicon Carbide, Glass, Lithium Niobate, Ceramics & Alumina, Fused Silica & Quartz, Borosilicate and Sapphire. If your substrate is not listed please enquire further as we may still be able to assist you.
- Total cut through or partially scribed
- Square and Circular substrates up to 150mm
- Thickness up to 4mm
- Standard and UV release tapes available