our services

Qudos offers a wide range of services that meet the demanding specifications of the semiconductor, photonics and Micro Electro Mechanical Systems (MEMS) industries.


Dicing Service

Our highly competitive dicing service provides you with a rapid turnaround service on dicing production.

Work pieces handled include wafers, substrates, mask plates and laminates.

A wide range of different materials can be processed including: Silicon, Silicon Carbide, Glass, Lithium Niobate, Ceramics & Alumina, Fused Silica & Quartz, Borosilicate and Sapphire. If your substrate is not listed please enquire further as we may still be able to assist you.

  • Total cut through or partially scribed
  • Square and Circular substrates up to 150mm
  • Thickness up to 4mm
  • Standard and UV release tapes available

Please complete our Dicing Enquiry Form.

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