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PECVD Deposition

We offer a service for depositing Oxide, Nitride and Oxy-nitride onto various substrates that are not temperature sensitive (the process is run at 300°C).

We have a wealth of experience in depositing dielectrics in this manner for applications as diverse as displays to medical devices.

Film thicknesses can be in the range of a few hundred angstroms to several microns, with uniformity typically better than 5% over a 6 inch wafer.

We are able to handle a range of substrate sizes and shapes, from part wafers upto 6 inch wafers / 6 inch square substrates.

Table of wafer/substrate capacity per run

Size / Shape of piece	No. of pieces per run
1/4 of 4" wafer	upto 28
4” wafer	7
4” square substrate	6
6” wafer	3
6” square substrate	2