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Sputtering

The following metals and dielectrics are our mostly commonly used: Chrome, Aluminium / Aluminium with 1% silicon, Ti-tungsten, Titanium, Gold and Copper. Dielectrics and other refractory and non-refractory metals can be deposited at the customers request.

Sputter type	No of wafers in run	Uniformity %	Available metals
RF (Nordiko)	1	5	Al, Au, Cr, Ni, Pb, etc..
DC Magnetron (Oxford 400)	1-4	3	TiW, Al, AlSi, Cr etc
DC Magnetron (CVC)	1-16	5	Au, Cr, Cu, Ti etc

Although the machines are set-up to run 4 and 6 inch wafers, they are also capable of running part pieces and smaller diameter wafers as well as rectangular substrates. The Oxford 400 system is load locked to increase wafer throughput and minimize particle contamination, whilst also providing excellent uniformity.