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ebeam lithography
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Bonding
We offer a wafer bonding service : • Anodic - Si:Glass • Direct (Fusion) - Si:Si • Thermocompression - Gold:Gold • Glass Frit - Quartz:Quartz • Adhesive - Silicon:Glass • Eutectic - Si:Gold
• Anodic - Si:Glass • Direct (Fusion) - Si:Si • Thermocompression - Gold:Gold • Glass Frit - Quartz:Quartz • Adhesive - Silicon:Glass • Eutectic - Si:Gold
Multi Layer Wafer Bonding