Dicing Service

We offer a competitive dicing service. Experienced engineers will provide a fast quote and rapid turnaround on dicing production.

Using our fully programmable Loadpoint MicroAce series 3 dicing machine we offer control to your required depth, pitch and cut width.
Any size substrate can be processed from 1” to 6”. Work pieces handled include wafers, substrates, mask plates and laminates.

We process a wide range of different materials which include: Silicon, Silicon Carbide, Glass, Lithium Niobate, Ceramics & Alumina, Fused Silica & Quartz, Borosilicate and Sapphire. If your substrate is not listed then please enquire.

 

DICING CAPABILITIES
• Saws fully CNC programmable
• Total cut through or partially scribed
• Square and Circular substrates upto 150mm
• Thickness: 100 microns to 4mm
• Positional Accuracy of 10 microns
• Kerf/Blade material loss: 60-300 microns
• U.V curable tapes

Please return the Dicing Enquiry Form to Qudos-Sales@rl.ac.uk

 

 

 

 

 

 

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